The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 06, 2022

Filed:

Sep. 11, 2018
Applicant:

Knowles Cazenovia, Inc., Cazenovia, NY (US);

Inventor:

David Bates, Fayetteville, NY (US);

Assignee:

Knowles Cazenovia, Inc., Cazenovia, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 5/16 (2006.01); H01P 1/20 (2006.01); H01P 11/00 (2006.01); H01P 3/08 (2006.01); H01L 25/065 (2006.01); H01L 23/538 (2006.01); H05K 3/46 (2006.01); H01L 23/66 (2006.01); H01L 23/552 (2006.01); H05K 1/14 (2006.01); H01L 25/10 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01); H05K 3/22 (2006.01); H05K 3/32 (2006.01); H05K 3/36 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01P 5/16 (2013.01); H01L 23/5387 (2013.01); H01L 23/552 (2013.01); H01L 23/66 (2013.01); H01L 25/0655 (2013.01); H01L 25/105 (2013.01); H01P 1/20 (2013.01); H01P 3/081 (2013.01); H01P 11/003 (2013.01); H05K 1/028 (2013.01); H05K 1/0243 (2013.01); H05K 1/115 (2013.01); H05K 1/144 (2013.01); H05K 1/147 (2013.01); H05K 3/0011 (2013.01); H05K 3/22 (2013.01); H05K 3/32 (2013.01); H05K 3/361 (2013.01); H05K 3/4691 (2013.01); H01L 2223/6627 (2013.01); H01L 2223/6683 (2013.01); H01L 2224/16227 (2013.01); H01L 2225/107 (2013.01); H01L 2225/1047 (2013.01); H01L 2924/15313 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/351 (2013.01); H05K 1/0216 (2013.01); H05K 1/189 (2013.01); H05K 3/363 (2013.01); H05K 2201/041 (2013.01); H05K 2201/042 (2013.01); H05K 2201/058 (2013.01); H05K 2201/1006 (2013.01); H05K 2201/10053 (2013.01);
Abstract

Methods for manufacturing a microwave or radio frequency (RF) device include mounting a printed circuit board (PCB) on a flexible PCB having at least one ground plane and a signal terminal. The PCB can include a through-hole the sidewalls of which are coated with a conductive material. The methods can include placing a microwave component within the through-hole. The methods can include disposing a conductive cover on the PCB such that the cover is in electrical contact with the ground plane of the flexible PCB through the conductive material, forming shielding around the microwave component. The flexible PCB can be folded along a respective bend portion.


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