The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 06, 2022

Filed:

Mar. 22, 2018
Applicant:

University-industry Cooperation Group of Kyung Hee University, Yongin-si, KR;

Inventors:

Jin Jang, Seoul, KR;

Min Sang Park, Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/00 (2006.01); H01L 51/50 (2006.01); H01L 25/13 (2006.01); H01L 29/66 (2006.01); H01L 29/786 (2006.01); H01L 27/12 (2006.01);
U.S. Cl.
CPC ...
H01L 51/003 (2013.01); H01L 25/13 (2013.01); H01L 27/1218 (2013.01); H01L 27/1225 (2013.01); H01L 27/1266 (2013.01); H01L 29/66969 (2013.01); H01L 29/7869 (2013.01); H01L 51/0097 (2013.01); H01L 51/502 (2013.01); H01L 2251/5338 (2013.01);
Abstract

Disclosed is a method of fabricating a stretchable electronic device, the method including a step of forming one or more semiconductor devices on a first carrier substrate; a step of forming semiconductor device array patterns by separating semiconductor device arrays each including the semiconductor devices; a step of releasing the semiconductor device array patterns from the first carrier substrate; a step of forming a stretchable substrate on a second carrier substrate; and a step of transferring the released semiconductor device array patterns onto the stretchable substrate.


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