The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 06, 2022

Filed:

Sep. 30, 2020
Applicant:

Lite-on Singapore Pte. Ltd., Singapore, SG;

Inventors:

Chien-Hsiu Huang, New Taipei, TW;

Yu-Chou Lin, New Taipei, TW;

Teck-Chai Goh, Singapore, SG;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/173 (2006.01); H01L 31/18 (2006.01); H01L 31/0216 (2014.01); H01L 31/0203 (2014.01);
U.S. Cl.
CPC ...
H01L 31/173 (2013.01); H01L 31/0203 (2013.01); H01L 31/02164 (2013.01); H01L 31/18 (2013.01);
Abstract

A manufacturing method of an optical sensor package includes: disposing a chip on a circuit board, the chip including a light emitting area and a light receiving area; disposing at least one light emitting element, which is electrically connected to the circuit board, on the light emitting area of the chip; coating a light blocking material between the light emitting area and the light receiving area; filling a light permeable material that covers the circuit board, the chip, the light blocking material, and the at least one light emitting element; removing a part of the light permeable material disposed between the light emitting area and the light receiving area, forming a first recess and expose the light blocking material; and filling an anti-light-leakage material in the first recess, to form a lateral light blocking structure through stacking the anti-light-leakage material and the light blocking material.


Find Patent Forward Citations

Huang, Chien-Hsiu. (2022). Optical sensor package and manufacturing method for the same (U.S. Patent No. 11437539). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11437539

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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