The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 06, 2022

Filed:

Jul. 22, 2020
Applicants:

Lite-on Opto Technology (Changzhou) Co., Ltd., Changzhou, CN;

Lite-on Technology Corporation, Taipei, TW;

Inventors:

Chien-Feng Kao, New Taipei, TW;

Chen-Hsiu Lin, New Taipei, TW;

Wen-Hsiang Lin, Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/20 (2006.01); H01L 33/00 (2010.01); H01L 25/16 (2006.01); H01L 23/00 (2006.01); H01L 33/62 (2010.01); H01L 33/56 (2010.01); H01L 33/60 (2010.01);
U.S. Cl.
CPC ...
H01L 25/165 (2013.01); H01L 24/06 (2013.01); H01L 24/08 (2013.01); H01L 25/167 (2013.01); H01L 33/62 (2013.01); H01L 33/56 (2013.01); H01L 33/60 (2013.01); H01L 2224/02331 (2013.01); H01L 2224/02371 (2013.01); H01L 2224/02372 (2013.01); H01L 2224/02377 (2013.01); H01L 2224/02381 (2013.01); H01L 2224/06182 (2013.01); H01L 2224/08145 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0091 (2013.01);
Abstract

A light-emitting package structure and a manufacturing method thereof are provided. The light-emitting package structure includes a driving device and at least one light-emitting chip. The driving device includes a driving chip and a redistribution layer structure formed over the driving chip. The driving chip has a first surface and a second surface opposite to the first surface. The redistribution layer structure includes a plurality of first conductive pads disposed on the first surface and a plurality of second conductive pads disposed on the second surface, and one of the first conductive pads is electrically connected to one of the second conductive pads. The at least one light-emitting chip is disposed on the first surface of the driving chip and electrically connected to the driving chip through the first conductive pads.


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