The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 06, 2022

Filed:

Feb. 07, 2020
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Jim Shih-Chun Liang, Poughkeepsie, NY (US);

Naftali E Lustig, Croton on Hudson, NY (US);

Atsushi Ogino, Fishkill, NY (US);

Nan Jing, Fishkill, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 21/3105 (2006.01); H01L 49/02 (2006.01); H01L 23/528 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5223 (2013.01); H01L 21/31053 (2013.01); H01L 23/5226 (2013.01); H01L 28/40 (2013.01); H01L 23/5286 (2013.01); H01L 28/60 (2013.01);
Abstract

A metal insulator metal capacitor and method for fabricating a metal insulator metal capacitor (MIMcap) are disclosed. A first level metal pattern is embedded in a first dielectric layer over a substrate. The first level metal pattern has a top surface co-planar with a top surface of the first dielectric layer. In a selected etch step, either one of the first metal pattern or the first dielectric is etched to form a stepped top surface. A conformal insulating layer on the stepped top surface. The MIMcap is formed on the conformal insulating layer in a conformal manner.


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