The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2022
Filed:
Jun. 19, 2020
Applicant:
Stmicroelectronics S.r.l., Agrate Brianza, IT;
Inventor:
Alberto Arrigoni, Como, IT;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49833 (2013.01); H01L 21/4828 (2013.01); H01L 21/4853 (2013.01); H01L 23/49541 (2013.01); H01L 23/49586 (2013.01); H01L 23/49877 (2013.01);
Abstract
A leadframe for a semiconductor device includes an array of electrically-conductive leads. The electrically-conductive leads have mutually opposed lateral (vertical) surfaces. An electrically-insulating material is formed over the mutually lateral opposed surfaces to prevent short circuits between adjacent leads. The electrically-insulating material may further be provided at one or more of the opposed bottom and top surfaces of the electrically-conductive leads of the leadframe.