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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11437306 B1

PDFFull Text
Date of Patent:
Sep. 06, 2022

Filed:

Feb. 02, 2021

Electronics unit with integrated metallic pattern

Applicant:

Stmicroelectronics (Grenoble 2) Sas, Grenoble, FR;

Inventors:

Romain Coffy, Voiron, FR;

Fabien Quercia, Isere, FR;

Assignee:

STMicroelectronics (Grenoble 2) SAS, Grenoble, FR;

Attorney:

Crowe & Dunlevy

Primary Examiner:

Yu-Hsi D Sun

Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/552 (2006.01); H01L 23/66 (2006.01); H01L 23/00 (2006.01); H01Q 1/22 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49811 (2013.01); H01L 21/4817 (2013.01); H01L 21/4853 (2013.01); H01L 23/552 (2013.01); H01L 23/66 (2013.01); H01L 24/48 (2013.01); H01Q 1/2283 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/48227 (2013.01);
Abstract

A non-conductive encapsulation cover is mounted on a support face of a support substrate to delimit, with the support substrate, an internal housing. An integrated circuit chip is mounted to the support substrate within the internal housing. A metal pattern is mounted to an internal wall of the non-conductive encapsulation cover in a position facing the support face. At least two U-shaped metal wires are provided within the internal housing, located to a side of the integrated circuit chip, and fixed at one end to the metallic pattern and at another end to the support face.

Find Patent Forward Citations

Coffy, Romain. (2022). Electronics unit with integrated metallic pattern (U.S. Patent No. 11437306). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11437306

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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