The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2022
Filed:
May. 26, 2020
Denso Corporation, Kariya, JP;
DENSO CORPORATION, Kariya, JP;
Abstract
A semiconductor module includes: semiconductor devices; a resin mold that integrally seals the semiconductor devices; and external terminals that are disposed at a lateral side of the resin mold along a direction perpendicular to a thickness direction of the semiconductor devices. Each semiconductor device includes an insulated gate semiconductor device having a gate electrode, a first electrode, and a second electrode. In the insulated gate semiconductor device, carriers move from the first electrode to the second electrode through a channel provided by a voltage applied to the gate electrode. The external terminals include: a gate terminal electrically connected to the gate electrode; a first terminal electrically connected to the first electrode; and a second terminal electrically connected to the second electrode. The gate terminal and the second terminal, which are electrically connected to an identical semiconductor device, are not adjacent to each other.