The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 06, 2022

Filed:

Sep. 14, 2017
Applicant:

Shindengen Electric Manufacturing Co., Ltd., Tokyo, JP;

Inventors:

Osamu Matsuzaki, Hanno, JP;

Kosuke Ikeda, Hanno, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 23/433 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4334 (2013.01); H01L 21/56 (2013.01); H01L 23/3121 (2013.01); H01L 23/5389 (2013.01); H01L 23/3735 (2013.01);
Abstract

An electronic module has a first substrate, an electronic elementdisposed on one side of the first substrate, a second substratedisposed on one side of the electronic element, a first coupling bodydisposed between the first substrateand the second substrate, a second coupling bodydisposed between the first substrateand the second substrate, and shorter than the first coupling body, and a sealing partwhich seals at least the electronic element. The first coupling bodyis not electrically connected to the electronic element. The second coupling bodyis electrically connected to the electronic element


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