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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11437295 B1

PDFFull Text
Date of Patent:
Sep. 06, 2022

Filed:

Mar. 19, 2020

Semiconductor package and electronic device having the same

Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Tae Hyun Kim, Suwon-si, KR;

Jung Hyun Lim, Suwon-si, KR;

Seung Goo Jang, Suwon-si, KR;

Eun Kyoung Kim, Suwon-si, KR;

Se Min Jin, Suwon-si, KR;

Assignee:

Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;

Attorney:

NSIP Law

Primary Examiner:

Telly D Green

Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 23/31 (2006.01); H01L 23/433 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 23/66 (2006.01);
U.S. Cl.
CPC ...
H01L 23/367 (2013.01); H01L 23/3107 (2013.01); H01L 23/3672 (2013.01); H01L 23/3677 (2013.01); H01L 23/4334 (2013.01); H01L 23/49811 (2013.01); H01L 23/5389 (2013.01); H01L 23/66 (2013.01); H01L 24/17 (2013.01); H01L 23/3128 (2013.01); H01L 24/16 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/291 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/83132 (2013.01); H01L 2224/83385 (2013.01); H01L 2224/92125 (2013.01); H01L 2224/92225 (2013.01); H01L 2924/1532 (2013.01); H01L 2924/16151 (2013.01); H01L 2924/16251 (2013.01); H01L 2924/19105 (2013.01);
Abstract

A semiconductor package includes a substrate including an antenna; a heating element disposed on a first surface of the substrate and connected to the antenna; a heat radiating part coupled to the heating element; and a signal transfer part disposed on the first surface of the substrate and configured to electrically connect the substrate to a main substrate. The heat radiating part may include a heat transfer part connected to the heating element and heat radiating terminals connecting the heat transfer part and the main substrate to each other.

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