The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 06, 2022

Filed:

Aug. 06, 2021
Applicant:

Littelfuse, Inc., Chicago, IL (US);

Inventors:

Marko Arciaga, Batangas, PH;

Gordon Todd Dietsch, Park Ridge, IL (US);

Roel Santos Retardo, Batangas, PH;

Deepak Nayar, Chicago, IL (US);

Assignee:

Littelfuse, Inc., Chicago, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01H 85/041 (2006.01); H01H 69/02 (2006.01);
U.S. Cl.
CPC ...
H01H 85/0411 (2013.01); H01H 69/02 (2013.01); H01H 2085/0414 (2013.01);
Abstract

A surface mount device chip fuse including a dielectric substrate, electrically conductive first and second upper terminals disposed on a top surface of the dielectric substrate and defining a gap therebetween, a fusible element formed of solder disposed on the top surface of the dielectric substrate, within the gap, bridging the first and second upper terminals, and electrically conductive first and second lower terminals disposed on a bottom surface of the dielectric substrate and electrically connected to the first and second upper terminals, respectively, wherein a material of the dielectric substrate exhibits a de-wetting characteristic relative to the solder from which the fusible element is formed.


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