The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 06, 2022

Filed:

Jun. 18, 2020
Applicants:

Yi-chung Chou, Taipei, TW;

Yu-chin Chen, Hsinchu, TW;

Tzu-i Huang, Hsinchu, TW;

Inventors:

Yi-Chung Chou, Taipei, TW;

Yu-Chin Chen, Hsinchu, TW;

Tzu-I Huang, Hsinchu, TW;

Assignee:

ITE Tech. Inc., Hsinchu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01K 7/00 (2006.01); G01K 7/01 (2006.01); G01K 1/18 (2006.01); G01K 7/20 (2006.01);
U.S. Cl.
CPC ...
G01K 7/01 (2013.01); G01K 1/18 (2013.01); G01K 7/20 (2013.01);
Abstract

The invention provides a temperature sensing device of an integrated circuit. The integrated circuit includes a plurality of stacked metal wire layers, and the temperature sensing device includes a first metal sheet, a first via and a second via. The first metal sheet is disposed between the first metal wire layer and the second metal wire layer of the metal wire layers. The first via and the second via are used to connect the first metal sheet and the first metal wire layer, wherein a temperature sensing signal enters the first metal sheet through the first via and leaves the first metal sheet through the second via to measure the temperature of the integrated circuit.


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