The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 06, 2022

Filed:

Dec. 14, 2017
Applicant:

3m Innovative Properties Company, St. Paul, MN (US);

Inventors:

Yongsuk Yang, Gyeonggi-do, KR;

Kyosung Hwang, Seoul, KR;

Gyu Jin Jung, Gyeonggi-do, KR;

Assignee:

3M INNOVATIVE PROPERTIES COMPANY, Saint Paul, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 7/10 (2018.01); C09J 7/40 (2018.01); C09J 133/12 (2006.01); C09J 133/06 (2006.01); C09J 133/08 (2006.01); C08K 3/04 (2006.01); C08K 3/22 (2006.01); C08K 3/36 (2006.01); C09J 133/10 (2006.01);
U.S. Cl.
CPC ...
C09J 7/10 (2018.01); C08K 3/04 (2013.01); C08K 3/22 (2013.01); C08K 3/36 (2013.01); C09J 7/403 (2018.01); C09J 133/066 (2013.01); C09J 133/08 (2013.01); C09J 133/10 (2013.01); C09J 133/12 (2013.01); C08K 2003/2227 (2013.01); C08K 2003/2241 (2013.01); C09J 2301/312 (2020.08); C09J 2301/40 (2020.08); C09J 2301/41 (2020.08); C09J 2301/416 (2020.08); C09J 2301/502 (2020.08); C09J 2433/00 (2013.01);
Abstract

The present invention relates to an adhesive film including a photothermal conversion layer including a light absorber and a thermally decomposable resin; and an adhesive layer, in which the thermally decomposable resin has a —COOH or —OH functional group and includes two kinds of acrylic resins having different weight average molecular weights, and an adhesive substrate including the adhesive film and a substrate to be processed. In the adhesive film and the adhesive substrate according to the present invention, it is possible to simplify a processing process of the substrate and reduce costs and time, and prevent damage to a substrate and a circuit or an element formed on the substrate.


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