The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2022
Filed:
Dec. 13, 2019
Applicant:
Elite Material Co., Ltd., Taoyuan, TW;
Inventor:
Chen-Yu Hsieh, Taoyuan, TW;
Assignee:
ELITE MATERIAL CO., LTD., Taoyuan, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 71/12 (2006.01); C08L 25/10 (2006.01); C08L 33/06 (2006.01); C08L 47/00 (2006.01); C08K 3/013 (2018.01); C08J 5/24 (2006.01); C08K 3/26 (2006.01);
U.S. Cl.
CPC ...
C08L 71/126 (2013.01); C08J 5/24 (2013.01); C08K 3/013 (2018.01); C08K 3/26 (2013.01); C08L 25/10 (2013.01); C08L 33/064 (2013.01); C08L 47/00 (2013.01); C08K 2003/267 (2013.01); C08L 2201/08 (2013.01); C08L 2203/16 (2013.01); C08L 2203/20 (2013.01);
Abstract
A resin composition includes a vinyl group-containing polyphenylene ether resin, a polyolefin and a magnesium and aluminum combination ionic compound, wherein the magnesium and aluminum combination ionic compound has a thermal resistance of greater than or equal to 600° C. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including glass transition temperature, copper foil peeling strength, thermal resistance and dissipation factor.