The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 06, 2022

Filed:

Nov. 26, 2018
Applicant:

The Yokohama Rubber Co., Ltd., Tokyo, JP;

Inventors:

Mitsuhiro Iwata, Hiratsuka, JP;

Tomohiro Ito, Hiratsuka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 61/30 (2006.01); C08J 5/24 (2006.01); C08L 63/00 (2006.01);
U.S. Cl.
CPC ...
C08L 63/00 (2013.01); C08J 5/24 (2013.01); C08J 2363/00 (2013.01); C08J 2409/00 (2013.01); C08J 2463/00 (2013.01); C08J 2481/06 (2013.01);
Abstract

In an epoxy resin composition, per 100 parts by mass of an epoxy resin component containing from 60 to 85 parts by mass of N,N,N',N′-tetraglycidyldiaminodiphenylmethane resin (A) having a viscosity at 50° C. of 6000 mPa·s or less and from 15 to 40 parts by mass of a liquid bisphenol A epoxy resin (B) having a viscosity at 25° C. of 20000 mPa·s or less, from 8 to 15 parts by mass of a thermoplastic resin (C), from 2 to 10 parts by mass of elastomer microparticles (D) having an average particle diameter of 1000 nm or less, and from 0.5 to 2.5 parts by mass of silica microparticles (E) having an average particle diameter of 1000 nm or less are blended.


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