The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2022
Filed:
Sep. 19, 2018
Dow Global Technologies Llc, Midland, MI (US);
Rohm and Haas Company, Collegeville, PA (US);
Xiaosong Wu, Freeport, TX (US);
Chuan-Yar Lai, Houston, TX (US);
Daniel W. Himmelberger, Collegeville, PA (US);
Vivek Kalihari, Freeport, TX (US);
Cristina Serrat, Freeport, TX (US);
Vinita Yadav, Collegeville, PA (US);
Dow Global Technologies LLC, Midland, MI (US);
Rohm and Haas Company, Collegeville, PA (US);
Abstract
The present disclosure includes a composition that includes an ethylene/α-olefin random copolymer having density of 0.890 g/cmor less, a melting point of 100° C. or less, and a melt index from 0.2 g/10 min to 8.0 g/10 min, a styrenic block copolymer comprising from 1 wt % to less than 50 wt % units of styrene, a tackifier, and an oil. The composition may exhibit an overall melt index of the composition of from 2 g/10 min to 15 g/10 min. The composition can be used as an adhesive in some embodiments. The present disclosure also includes multilayer films that include the composition, which may provide reclose functionality to the multilayer film. The multilayer films that include the composition may provide low initial opening force and improved reclose adhesion through multiple reclose cycles. The present disclosure also includes various types of reclosable packaging articles that include the multilayer films and adhesive compositions.