The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2022
Filed:
Aug. 07, 2018
Nitto Denko Corporation, Ibaraki, JP;
Yusuke Yamanari, Ibaraki, JP;
Makoto Saito, Ibaraki, JP;
Akira Hirao, Ibaraki, JP;
Kenji Furuta, Ibaraki, JP;
NITTO DENKO CORPORATION, Ibaraki, JP;
Abstract
A resin sheet with a pressure-sensitive adhesive layer including the resin sheet. The resin sheet including a main surface A and a main surface B opposite to each other across a thickness 'd', where the resin sheet has a 50% compression load of 20 N/cmor less at 23±5° C. in a direction of the thickness 'd', which is measured in conformity with a method of measuring a compression hardness described in JIS K 6767:1999; where the resin sheet has a Poisson's ratio at 23° C. of 0.10 or less; and the resin sheet has a thickness recovery ratio of 40% or more when compressed by 20% in the direction of the thickness “d” at 23° C.