The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2022
Filed:
Feb. 06, 2019
Applicant:
Hewlett-packard Development Company, L.p., Fort Collins, CO (US);
Inventors:
Chien-Hua Chen, Corvallis, OR (US);
Jimmy Perez, Corvallis, OR (US);
Assignee:
Hewlett-Packard Development Company, L.P., Spring, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 33/30 (2006.01); B41J 2/14 (2006.01); B29C 33/00 (2006.01); B29C 33/14 (2006.01); B29C 33/42 (2006.01); B29C 39/10 (2006.01); B29K 63/00 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
B29C 33/308 (2013.01); B29C 33/0022 (2013.01); B29C 33/14 (2013.01); B29C 33/303 (2013.01); B29C 33/306 (2013.01); B29C 33/307 (2013.01); B29C 33/42 (2013.01); B29C 39/10 (2013.01); B29K 2063/00 (2013.01); B29L 2031/7678 (2013.01);
Abstract
A mold assembly may include a mold frame having an opening extending in a plane and a movable mold insert adjuster to move a mold insert having a slot forming protrusion within the plane within opening.