The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2022
Filed:
Mar. 13, 2019
Applicant:
Toshiba Mitsubishi-electric Industrial Systems Corporation, Chuo-ku, JP;
Inventors:
Assignee:
Primary Examiner:
Int. Cl.
CPC ...
B23K 20/00 (2006.01); B23K 20/10 (2006.01); B23K 103/00 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
B23K 20/10 (2013.01); B23K 20/002 (2013.01); B23K 2101/40 (2018.08); B23K 2103/54 (2018.08); B23K 2103/56 (2018.08);
Abstract
In an ultrasonic bonding method, three ultrasonic bonding head units are disposed above a bonding target. At this time, initial heights in the three ultrasonic bonding head units are set to different heights from each other. Thereafter, a batch multiple lowering operation by a lifting-lowering servomotor and ultrasonic vibration operations by the three ultrasonic bonding head units are executed. At this time, a lowering speed Vof the batch multiple lowering operation, an operation time T(min) of the ultrasonic vibration operation, and an adjustment gap length Δg among the initial heights are set to satisfy {T<Δg/V