The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 06, 2022

Filed:

Aug. 21, 2018
Applicant:

Ntn Corporation, Osaka, JP;

Inventors:

Yoshinori Ito, Aichi, JP;

Sunao Shimizu, Aichi, JP;

Eiichirou Shimazu, Mie, JP;

Takahiro Okuno, Mie, JP;

Assignee:

NTN CORPORATION, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 1/00 (2022.01); B32B 15/01 (2006.01); F16C 33/12 (2006.01); B22F 7/06 (2006.01); B22F 3/02 (2006.01); B22F 3/10 (2006.01); F16C 33/10 (2006.01); B22F 1/068 (2022.01);
U.S. Cl.
CPC ...
B22F 1/0003 (2013.01); B22F 1/068 (2022.01); B22F 3/02 (2013.01); B22F 3/10 (2013.01); B22F 7/06 (2013.01); B32B 15/015 (2013.01); F16C 33/104 (2013.01); F16C 33/128 (2013.01); B32B 2255/06 (2013.01);
Abstract

Provided is a sintered bearing that is capable of reducing cost through reduction in usage amount of copper, excellent in initial running-in characteristics and quietness, and is high in durability. Raw material powders including iron powder, flat copper powder, low-melting point metal powder, and graphite are loaded into a mold, and a green compact is formed under a state in which the flat copper powder is caused to adhere onto a molding surface. Subsequently, sintering is carried out without causing iron in the green compact to react with carbon so that an iron structure is formed of a ferrite phase. In this manner, a sintered bearing () including a base part (S) including copper at a uniform content, and a surface layer (S) covering a surface of the base part (S) and including copper at a larger content than the base part (S) can be obtained.


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