The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 30, 2022

Filed:

Jun. 05, 2019
Applicant:

Dell Products L.p., Round Rock, TX (US);

Inventors:

Yu-Lin Tsai, New Taipei, TW;

Chia-Hsien Lu, Taoyuan, TW;

Chun-Min He, Taipei, TW;

RungLung Lin, Taipei, TW;

Chin-Chung Wu, New Taipei, TW;

Assignee:

Dell Products L.P., Round Rock, TX (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 13/04 (2006.01); H05K 3/30 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 13/0465 (2013.01); H05K 1/181 (2013.01); H05K 3/303 (2013.01); H05K 2201/10689 (2013.01);
Abstract

An information handling system printed circuit board includes solder pads that accept footprint compatible integrated circuits, such as charger integrated circuits that provide power with different choke circuit supporting components. Solder pads for supporting components include first and second conductive areas sized to accept a first supporting component, each of the first and second conductive areas including an intervening non-conductive area that manages positioning of a smaller second supporting component at solder reflow.


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