The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 30, 2022

Filed:

Jun. 21, 2017
Applicant:

Mitsubishi Electric Corporation, Chiyoda-ku, JP;

Inventors:

Takaaki Takahara, Chiyoda-ku, JP;

Satoshi Murakami, Chiyoda-ku, JP;

Ryota Kondo, Chiyoda-ku, JP;

Hiroyasu Iwabuki, Chiyoda-ku, JP;

Hiroyuki Higashino, Chiyoda-ku, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01F 27/22 (2006.01); H01F 27/24 (2006.01); H01F 27/28 (2006.01); H02M 3/158 (2006.01); H02M 3/335 (2006.01); H05K 1/02 (2006.01); H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
H05K 7/209 (2013.01); H01F 27/22 (2013.01); H01F 27/24 (2013.01); H01F 27/2804 (2013.01); H02M 3/158 (2013.01); H02M 3/33584 (2013.01); H05K 1/0204 (2013.01); H05K 1/165 (2013.01); H01F 2027/2809 (2013.01);
Abstract

A power conversion device includes: a main body including a substrate to which a power conversion unit and a coil are provided; and a first heat dissipation portion which holds the substrate and dissipates heat of the substrate, wherein the substrate is formed by one sheet, the coil is formed integrally with the substrate, the first heat dissipation portion is fixed to a substrate first surface of the substrate, a heat dissipation second surface of the first heat dissipation portion has a coil cooling portion opposed to and abutting on a part where the coil is formed, of the substrate.


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