The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 30, 2022
Filed:
Nov. 01, 2019
Hitachi Automotive Systems, Ltd., Hitachinaka, JP;
Tokihito Suwa, Hitachinaka, JP;
Yujiro Kaneko, Hitachinaka, JP;
Yusuke Takagi, Hitachinaka, JP;
Shinichi Fujino, Mito, JP;
Takahiro Shimura, Mito, JP;
Hitachi Astemo, Ltd., Hitachinaka, JP;
Abstract
A semiconductor module includes a first power semiconductor element having a first surface and a second surface. The semiconductor module also includes a second power semiconductor element having a first surface and a second surface. The semiconductor module also includes first, second, third, and fourth conductor plates, and a connecting part. The connecting part is integrally formed with the second conductor plate, extends toward the third conductor plate, and is connected to the third conductor plate.