The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 30, 2022

Filed:

Oct. 15, 2019
Applicant:

Microchip Technology Incorporated, Chandler, AZ (US);

Inventors:

Venkatraman Iyer, Austin, TX (US);

Dixon Chen, Shenzhen, CN;

John Junling Zang, Shenzhen, CN;

Shivanand I. Akkihal, Austin, TX (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04L 7/00 (2006.01); H04L 69/323 (2022.01);
U.S. Cl.
CPC ...
H04L 7/0041 (2013.01); H04L 69/323 (2013.01);
Abstract

Disclosed embodiments relate, generally, to improved data reception handling at a physical layer. Some embodiments relate to end of line systems that include legacy media access control (MAC) devices and PHY devices that implement improved data reception handling disclosed herein. The improved data reception handling improves the operation of legacy systems, and the MAC more specifically, and in some cases to comply with media access tuning protocols implemented at the physical layer.


Find Patent Forward Citations

Iyer, Venkatraman. (2022). Physical layer to link layer interface and related systems, methods and devices (U.S. Patent No. 11431468). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11431468

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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