The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 30, 2022
Filed:
Jan. 28, 2021
Applicant:
Tdk Corporation, Tokyo, JP;
Inventors:
Yuta Ashida, Tokyo, JP;
Masahiro Tatematsu, Tokyo, JP;
Shuhei Sawaguchi, Tokyo, JP;
Shigemitsu Tomaki, Tokyo, JP;
Tetsuzo Goto, Tokyo, JP;
Takeshi Kijima, Tokyo, JP;
Assignee:
TDK CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 5/10 (2006.01); H03H 7/42 (2006.01); H03H 7/09 (2006.01); H01P 3/08 (2006.01); H01G 4/30 (2006.01); H03H 7/01 (2006.01); H03H 1/00 (2006.01);
U.S. Cl.
CPC ...
H01P 5/10 (2013.01); H01G 4/30 (2013.01); H01P 3/082 (2013.01); H03H 7/0115 (2013.01); H03H 7/09 (2013.01); H03H 7/42 (2013.01); H03H 2001/0085 (2013.01);
Abstract
A balun includes first to fourth lines and a stack. A plurality of first conductor layers forming the first and third lines are located in a first region in the stack. A plurality of second conductor layers forming the second and fourth lines are located in a second region in the stack. A ground conductor layer is located closer to the second region than to the first region. The plurality of second conductor layers include a conductor layer pair where a distance between two conductor layers is smallest.