The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 30, 2022
Filed:
Nov. 22, 2018
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventor:
Shin Chaki, Nagasaki, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 3/08 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H01P 3/08 (2013.01); H05K 1/0237 (2013.01); H05K 1/0277 (2013.01);
Abstract
A flexible substrate () is bent at a bending part (). A dielectric plate () has first and second main surfaces opposite to each other. A high-frequency signal line () is provided on the first main surface of the dielectric plate (). A ground conductor () is provided on the second main surface of the dielectric plate (). The high-frequency signal line () and the ground conductor () form a micro strip line. A local absent part () facing the high-frequency signal line () is provided on the ground conductor () only at the bending part ().