The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 30, 2022

Filed:

Sep. 07, 2017
Applicant:

Semiconductor Energy Laboratory Co., Ltd., Atsugi, JP;

Inventors:

Shunpei Yamazaki, Tokyo, JP;

Junichi Koezuka, Tochigi, JP;

Yukinori Shima, Tochigi, JP;

Masami Jintyou, Tochigi, JP;

Takashi Hamochi, Tochigi, JP;

Satoshi Higano, Tochigi, JP;

Yasuharu Hosaka, Tochigi, JP;

Toshimitsu Obonai, Tochigi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01); H01L 49/02 (2006.01); H01L 29/786 (2006.01); H01L 29/45 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1255 (2013.01); H01L 28/20 (2013.01); H01L 28/24 (2013.01); H01L 28/60 (2013.01); H01L 29/45 (2013.01); H01L 29/7869 (2013.01); H01L 29/78693 (2013.01);
Abstract

A novel semiconductor device in which a metal film containing copper (Cu) is used for a wiring, a signal line, or the like in a transistor including an oxide semiconductor film is provided. The semiconductor device includes an oxide semiconductor film having conductivity on an insulating surface and a conductive film in contact with the oxide semiconductor film having conductivity. The conductive film includes a Cu—X alloy film (X is Mn, Ni, Cr, Fe, Co, Mo, Ta, or Ti).


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