The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 30, 2022

Filed:

Jan. 23, 2020
Applicant:

Infineon Technologies Dresden Gmbh & Co. KG, Dresden, DE;

Inventor:

Joachim Weyers, Hoehenkirchen, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/02 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0255 (2013.01); H01L 23/5226 (2013.01); H01L 27/0292 (2013.01); H01L 27/0296 (2013.01);
Abstract

In an embodiment, a semiconductor die includes a transistor device that has a cell field and an edge termination region, a source pad arranged on the cell field, a gate pad laterally arranged laterally adjacent the cell field and in the edge termination region, a shielding region laterally surrounding the cell field, the shielding region including a non-depletable doped. The polysilicon ESD protection diode is arranged laterally between the gate pad and the source pad and vertically above at least a portion of the shielding region, and includes at least two separate sections that are electrically coupled in parallel between the gate pad and the source pad. The sections are laterally spaced apart by a gap situated at a corner of the gate pad.


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