The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 30, 2022

Filed:

Oct. 23, 2020
Applicant:

Brother Kogyo Kabushiki Kaisha, Nagoya, JP;

Inventor:

Keita Hirai, Nagoya, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 23/00 (2006.01); H01L 25/16 (2006.01); H01L 23/538 (2006.01); H01L 21/48 (2006.01); H01L 41/04 (2006.01); H01L 41/09 (2006.01); H01L 27/20 (2006.01); H01L 41/047 (2006.01); B41J 2/14 (2006.01); B41J 2/045 (2006.01); H01L 41/187 (2006.01); H01L 41/053 (2006.01);
U.S. Cl.
CPC ...
H01L 24/16 (2013.01); B41J 2/14233 (2013.01); H01L 21/486 (2013.01); H01L 23/5384 (2013.01); H01L 24/17 (2013.01); H01L 25/0655 (2013.01); H01L 25/162 (2013.01); H01L 27/20 (2013.01); H01L 41/042 (2013.01); H01L 41/0475 (2013.01); H01L 41/0973 (2013.01); B41J 2/04541 (2013.01); B41J 2/04586 (2013.01); B41J 2002/14491 (2013.01); B41J 2202/18 (2013.01); H01L 41/047 (2013.01); H01L 41/053 (2013.01); H01L 41/1876 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/17177 (2013.01); H01L 2924/1426 (2013.01); H01L 2924/1461 (2013.01);
Abstract

An electronic device includes: a first substrate having a first surface and a second surface opposite from the first surface; a second substrate facing the first surface; driven elements provided at the second substrate; a drive circuit facing the second surface; a first interconnect provided at the first surface; a second interconnect provided at the second surface; a through-substrate interconnection part penetrating the first substrate in a thickness direction thereof; a first bump part; and a second bump part. The drive circuit is capable of outputting drive signals for driving the driven elements. The through-substrate interconnection part electrically connects the first interconnect and the second interconnect. The first bump part electrically connects the first interconnect and the driven elements. The second bump part electrically connects the second interconnect and the drive circuit. The through-substrate interconnection part has an electrical resistance lower than an electrical resistance of the second bump part.


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