The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 30, 2022

Filed:

Aug. 10, 2017
Applicant:

Cree, Inc., Durham, NC (US);

Inventors:

David Seebacher, Villach, AT;

Christian Schuberth, Villach-Landskron, AT;

Peter Singerl, Villach, AT;

Alexander Komposch, Morgan Hill, CA (US);

Assignee:

Cree, Inc., Durham, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 23/373 (2006.01); H01L 23/00 (2006.01); H01L 23/42 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 21/4878 (2013.01); H01L 21/4882 (2013.01); H01L 24/75 (2013.01); H01L 24/83 (2013.01); H01L 23/367 (2013.01); H01L 23/3736 (2013.01); H01L 23/42 (2013.01); H01L 24/32 (2013.01); H01L 2224/291 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32013 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/75703 (2013.01); H01L 2224/83048 (2013.01); H01L 2224/8382 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/83097 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83193 (2013.01); H01L 2224/83424 (2013.01); H01L 2224/83444 (2013.01); H01L 2224/83447 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10254 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/15724 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/351 (2013.01); H01L 2924/3512 (2013.01);
Abstract

In sonic examples, a method includes pre-stressing a flange, heating the flange to a die-attach temperature, and attaching a die to the flange at the die-attach temperature using a die-attach material. In some examples, the flange includes a metal material, the die-attach temperature may be at least two hundred degrees Celsius, and the die-attach material may include solder and/or an adhesive. In some examples, the method includes cooling the semiconductor die and metal flange to a room temperature after attaching the semiconductor die to the metal flange at the die-attach temperature using a die-attach material.


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