The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 30, 2022
Filed:
Feb. 19, 2020
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventor:
Michael Stadler, Munich, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/528 (2006.01); H01L 25/065 (2006.01); H01L 23/00 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 23/528 (2013.01); H01L 23/53214 (2013.01); H01L 23/53228 (2013.01); H01L 24/08 (2013.01); H01L 24/32 (2013.01); H01L 25/0657 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/0807 (2013.01); H01L 2224/32145 (2013.01);
Abstract
A semiconductor arrangement includes a lower semiconductor chip, an upper semiconductor chip arranged over an upper main side of the lower semiconductor chip, a metallization layer arranged on the upper main side of the lower semiconductor chip, and a bonding material which fastens the upper semiconductor chip on the lower semiconductor chip. The metallization layer includes a structure with increased roughness in comparison with the rest of the metallization layer, the structure being arranged along a contour of the upper semiconductor chip.