The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 30, 2022
Filed:
Apr. 18, 2018
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventor:
Yosuke Nakata, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01L 23/492 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49844 (2013.01); H01L 23/3121 (2013.01); H01L 23/492 (2013.01); H01L 23/49811 (2013.01); H01L 24/48 (2013.01); H01L 2224/48157 (2013.01); H01L 2224/48599 (2013.01);
Abstract
A semiconductor device (-) and a wiring device () are provided on a main surface of a base plate (). A first wire (-) connects an external electrode (-) and a first relay pad (-) of the wiring device (). A second wire (-) connects a pad (-) of the semiconductor device (-) and the second relay pad (-) of the wiring device (). Resin () seals the semiconductor device (-), the wiring device () and the first and second wires (--). The second wire (-) is thinner than the first wire (-). The pad (-) is smaller than the first relay pad (-).