The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 30, 2022
Filed:
Apr. 18, 2018
Mitsubishi Electric Corporation, Tokyo, JP;
Yosuke Nakata, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
A semiconductor device (-) and a wiring device () are provided on a main surface of a base plate (). A first wire (-) connects an external electrode (-) and a first relay pad (-) of the wiring device (). A second wire (-) connects a pad (-) of the semiconductor device (-) and the second relay pad (-) of the wiring device (). Resin () seals the semiconductor device (-), the wiring device () and the first and second wires (--). The second wire (-) is thinner than the first wire (-). The pad (-) is smaller than the first relay pad (-).
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile