The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 30, 2022
Filed:
May. 07, 2021
Microchip Technology Incorporated, Chandler, AZ (US);
Behrooz Mehr, Chandler, AZ (US);
Microchip Technology Incorporated, Chandler, AZ (US);
Abstract
Lead frames for semiconductor device packages may include lead fingers proximate to a die-attach pad. A convex corner of the die-attach pad, or of the lead fingers proximate to a geometric center of the lead frame may be rounded to exhibit a radius of curvature of at least two times a greatest thickness of the die-attach pad, the thickness measured in a direction perpendicular to a major surface of the die-attach pad. A shortest distance between the die-attach pad and a largest of the lead fingers may be at least two times the greatest thickness of the die-attach pad.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile