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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11430611 B1

PDFFull Text
Date of Patent:
Aug. 30, 2022

Filed:

Feb. 02, 2021

Thin film capacitor, circuit board incorporating the same, and thin film capacitor manufacturing method

Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Yuuki Aburakawa, Tokyo, JP;

Tatsuo Namikawa, Tokyo, JP;

Akiyasu Iioka, Tokyo, JP;

Atsuo Matsutani, Tokyo, JP;

Hitoshi Saita, Tokyo, JP;

Kazuhiro Yoshikawa, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:

Young Law Firm, P.C.

Primary Examiner:

David M Sinclair

Assistant Examiner:

Daniel M Dubuisson

Int. Cl.
CPC ...
H01G 4/33 (2006.01); H01G 4/008 (2006.01); H01G 4/012 (2006.01); H01G 4/30 (2006.01); H01L 23/498 (2006.01); H01L 23/64 (2006.01); H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
H01G 4/33 (2013.01); H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/306 (2013.01); H01L 23/49822 (2013.01); H01L 23/642 (2013.01); H05K 1/162 (2013.01);
Abstract

Disclosed herein a thin film capacitor that includes a lower electrode layer, an upper electrode layer, and a dielectric layer disposed between the lower electrode layer and the upper electrode layer. The dielectric layer has a through hole. The upper electrode layer has a connection part connected to the lower electrode layer through the through hole and an electrode part insulated from the connection part by a slit. A surface of the lower electrode layer that contacts the connection part through the through hole includes an annular area positioned along an inner wall surface of the through hole and a center area surrounded by the annular area. The annular area is lower in surface roughness than the center area.

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Aburakawa, Yuuki. (2022). Thin film capacitor, circuit board incorporating the same, and thin film capacitor manufacturing method (U.S. Patent No. 11430611). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11430611

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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