The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 30, 2022

Filed:

Feb. 06, 2020
Applicant:

Murata Manufacturing Co., Ltd., Kyoto-fu, JP;

Inventors:

Akio Igarashi, Nagaokakyo, JP;

Yuuji Igarashi, Nagaokakyo, JP;

Takao Miyamoto, Nagaokakyo, JP;

Takuya Ishida, Nagaokakyo, JP;

Koji Onishi, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/29 (2006.01); H01F 27/28 (2006.01); H01F 27/24 (2006.01);
U.S. Cl.
CPC ...
H01F 27/292 (2013.01); H01F 27/24 (2013.01); H01F 27/2823 (2013.01);
Abstract

An adhesive layer is in contact with a rising portion of a metal terminal and an outer end surface of a flange portion of a drum-shaped core. A surface of the rising portion that faces the outer end surface is an inclined surface that inclines with respect to the outer end surface. The thickest portion of the adhesive layer is located near a position at which a distance between the inclined surface and the outer end surface is largest. The thickness of the thickest portion of the adhesive layer is 13 μm or more.


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