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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11429018 B1

PDFFull Text
Date of Patent:
Aug. 30, 2022

Filed:

Sep. 13, 2018

Method of manufacturing chemical fluid for manufacturing electronic material, pattern forming method, method of manufacturing semiconductor device, chemical fluid for manufacturing electronic material, container, and quality inspection method

Applicant:

Fujifilm Corporation, Tokyo, JP;

Inventors:

Tetsuya Shimizu, Shizuoka, JP;

Tsukasa Yamanaka, Shizuoka, JP;

Yukihisa Kawada, Shizuoka, JP;

Assignee:

FUJIFILM Corporation, Tokyo, JP;

Attorney:

JCIPRNET

Primary Examiner:

Daborah Chacko-Davis

Int. Cl.
CPC ...
G03F 7/32 (2006.01); G03F 1/68 (2012.01); G03F 7/40 (2006.01); G03F 7/11 (2006.01); G03F 7/039 (2006.01); G03F 7/16 (2006.01); G03F 7/00 (2006.01); G03F 1/86 (2012.01); G03F 7/38 (2006.01); H01J 49/10 (2006.01);
U.S. Cl.
CPC ...
G03F 1/68 (2013.01); G03F 1/86 (2013.01); G03F 7/0012 (2013.01); G03F 7/0397 (2013.01); G03F 7/11 (2013.01); G03F 7/16 (2013.01); G03F 7/32 (2013.01); G03F 7/325 (2013.01); G03F 7/38 (2013.01); G03F 7/40 (2013.01); H01J 49/105 (2013.01);
Abstract

In a method of manufacturing a chemical fluid for manufacturing an electronic material, a method of reducing particulate metal in the chemical fluid is selected according to a concentration of particulate metal including an iron atom, a concentration of particulate metal including a copper atom, and a concentration of particulate metal including a zinc atom which are measured by SP ICP-MS in the chemical fluid, and at least one of the concentration of particulate metal including an iron atom, the concentration of particulate metal including a copper atom, or the concentration of particulate metal including a zinc atom is reduced by using the selected reducing method.

Find Patent Forward Citations

Shimizu, Tetsuya. (2022). Method of manufacturing chemical fluid for manufacturing electronic material, pattern forming method, method of manufacturing semiconductor device, chemical fluid for manufacturing electronic material, container, and quality inspection method (U.S. Patent No. 11429018). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11429018

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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