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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11428661 B1

PDFFull Text
Date of Patent:
Aug. 30, 2022

Filed:

Nov. 22, 2019

Method for producing a moisture sensor at the wafer level and moisture sensor

Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Marco Haubold, Dresden, DE;

Heiko Froehlich, Radebeul, DE;

Thoralf Kautzsch, Dresden, DE;

Olga Khvostikova, Dresden, DE;

Marten Oldsen, Anzing, DE;

Bernhard Straub, Neubiberg, DE;

Assignee:

INFINEON TECHNOLOGIES AG, Neubiberg, DE;

Attorney:

Slater Matsil, LLP

Primary Examiner:

Jamel E Williams

Int. Cl.
CPC ...
G01N 27/00 (2006.01); G01N 27/22 (2006.01); H01L 21/52 (2006.01); H01L 21/56 (2006.01); H01L 23/28 (2006.01);
U.S. Cl.
CPC ...
G01N 27/223 (2013.01); G01N 27/226 (2013.01); H01L 21/52 (2013.01); H01L 21/56 (2013.01); H01L 23/28 (2013.01);
Abstract

In accordance with an embodiment, a method for producing a moisture sensor includes providing a substrate arrangement, applying a sensor structure, applying a first cover layer on the sensor structure, locally removing the planar cover layer arrangement to expose portions of an insulation layer, applying a third cover layer on the exposed portions of the insulation layer, exposing the planar cover layer arrangement covering the sensor structure, and applying a moisture-absorbing layer element on the planar cover layer arrangement covering the sensor structure to obtain the moisture sensor.

Find Patent Forward Citations

Haubold, Marco. (2022). Method for producing a moisture sensor at the wafer level and moisture sensor (U.S. Patent No. 11428661). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11428661

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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