The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 30, 2022

Filed:

Sep. 21, 2020
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Kihak Nam, Daejeon, KR;

Sungyoon Ryu, Seoul, KR;

Kwangeun Kim, Hwaseong-si, KR;

Hwiwoo Park, Incheon, KR;

Dayoung Yoon, Incheon, KR;

Myoungkyu Choi, Incheon, KR;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 21/95 (2006.01); H01L 21/687 (2006.01); G01N 21/55 (2014.01); G01N 21/21 (2006.01);
U.S. Cl.
CPC ...
G01N 21/9501 (2013.01); G01N 21/55 (2013.01); H01L 21/687 (2013.01); G01N 2021/213 (2013.01);
Abstract

According to embodiments, a wafer inspection device is provided. The wafer inspection device includes a porous chuck including a plurality of pores formed all over the porous chuck to allow pressure for fixing a wafer to be applied thereto, a chuck driving device, a back side inspection optical system configured to inspect a portion of a back surface of the wafer, and a position identification optical system, wherein the porous chuck includes a plurality of holes uniformly formed all over the porous chuck to partially expose the back surface of the wafer and a slit exposing the back surface of the wafer and extending in one direction parallel to a top surface of the porous chuck.


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