The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 30, 2022

Filed:

Apr. 23, 2020
Applicant:

Northeastern University, Shenyang, CN;

Inventors:

Engang Wang, Shenyang, CN;

Bailing An, Shenyang, CN;

Lin Zhang, Shenyang, CN;

Assignee:

NORTHEASTERN UNIVERSITY, Shenyang, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C22F 1/08 (2006.01); C22C 1/03 (2006.01); C22C 9/00 (2006.01); C22F 1/02 (2006.01);
U.S. Cl.
CPC ...
C22F 1/08 (2013.01); C22C 1/03 (2013.01); C22C 9/00 (2013.01); C22F 1/02 (2013.01);
Abstract

Provided are a high-strength and high-conductivity Cu—Ag—Sc alloy and a preparation method thereof. The preparation method includes the following steps: (1) placing metal Ag and metal Sc in an electric-arc furnace and performing smelting under a vacuum condition, performing cooling to normal temperature in the furnace to obtain an Ag—Sc intermediate alloy; (2) placing the Ag—Sc intermediate alloy, an electrolytic copper and the metal Ag in an induction furnace and performing heating to 1200-1300° C. under a vacuum condition, keeping at the temperature for 10-60 min for smelting, then performing casting and cooling to normal temperature in the furnace to obtain ingots; (3) heating the ingots to 700-850° C. under an inert atmosphere, then performing water quenching to normal temperature to obtain heat-treated ingots; and (4) heating the heat-treated ingots to 400-500° C. under an inert atmosphere, then performing air cooling to normal temperature to obtain the high-strength and high-conductivity Cu—Ag—Sc.


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