The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 30, 2022

Filed:

Nov. 17, 2017
Applicant:

Hewlett-packard Development Company, L.p., Spring, TX (US);

Inventors:

Carolin Fleischmann, San Diego, CA (US);

Rachael Donovan, San Diego, CA (US);

Shannon Reuben Woodruff, San Diego, CA (US);

Yi Feng, San Diego, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B33Y 70/00 (2020.01); C09D 11/102 (2014.01); B33Y 10/00 (2015.01); B29C 64/165 (2017.01); C09D 11/30 (2014.01); B29K 77/00 (2006.01);
U.S. Cl.
CPC ...
C09D 11/102 (2013.01); B29C 64/165 (2017.08); B33Y 10/00 (2014.12); B33Y 70/00 (2014.12); C09D 11/30 (2013.01); B29K 2077/00 (2013.01);
Abstract

Compositions including polyamides and methods of employing compositions including polyamides are described herein. For instance, composition for three-dimensional (3D) printing can include a polymer build material comprising of at least two polyamides including a first polyamide and a second polyamide, where the first polyamide is present in an amount ranging of from about 95% to about 99% of a total weight of the polymer build material and where the second polyamide is present in an amount ranging of from about 1% to about 5% of the total weight of the polymer build material.


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