The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 30, 2022
Filed:
Dec. 06, 2018
Applicants:
Samsung Display Co., Ltd., Yongin-si, KR;
Kcc Corporation, Seoul, KR;
Inventors:
Dongho Kim, Hwaseong-si, KR;
Daehwan Kim, Yongin-si, KR;
Jungho Ahn, Hwaseong-si, KR;
Soyeon Lee, Uijeongbu-si, KR;
Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08F 265/06 (2006.01); C08F 283/01 (2006.01); C09D 4/06 (2006.01); C08F 2/48 (2006.01); C08L 33/10 (2006.01); C08L 33/14 (2006.01); C08K 5/07 (2006.01); C08K 5/53 (2006.01); C08J 5/18 (2006.01); B32B 27/30 (2006.01); B32B 7/12 (2006.01); C09J 4/06 (2006.01); C08F 20/28 (2006.01); C08F 20/36 (2006.01); C08F 220/18 (2006.01); C08F 220/28 (2006.01);
U.S. Cl.
CPC ...
C08F 265/06 (2013.01); B32B 7/12 (2013.01); B32B 27/308 (2013.01); C08F 2/48 (2013.01); C08F 283/01 (2013.01); C08J 5/18 (2013.01); C08K 5/07 (2013.01); C08K 5/53 (2013.01); C08L 33/10 (2013.01); C08L 33/14 (2013.01); C09D 4/06 (2013.01); C09J 4/06 (2013.01); B32B 2255/26 (2013.01); B32B 2305/72 (2013.01); B32B 2310/0831 (2013.01); B32B 2457/20 (2013.01); C08F 20/28 (2013.01); C08F 20/36 (2013.01); C08F 220/1811 (2020.02); C08F 220/281 (2020.02);
Abstract
Provided are a photocurable resin composition and fabrication method of window member using the same. The photocurable resin composition includes a (meth)acrylic resin, a urethane acrylate oligomer, a photopolymerizable monomer and a photopolymerization initiator. Accordingly, deterioration in physical properties such as cracking or decrease of adhesion under additional ultraviolet irradiation conditions, high temperature and high humidity conditions, and thermal shock conditions does not occur.