The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 30, 2022

Filed:

Jun. 20, 2019
Applicant:

Kyocera Corporation, Kyoto, JP;

Inventors:

Tadashi Nagasawa, Soraku-gun, JP;

Satoshi Yoshiura, Soraku-gun, JP;

Chie Chikara, Kyotanabe, JP;

Satoshi Kajita, Ikoma, JP;

Yasuhide Tami, Aira, JP;

Assignee:

KYOCERA CORPORATION, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/26 (2006.01); B32B 15/08 (2006.01); B32B 27/08 (2006.01); B32B 27/20 (2006.01); C08J 5/18 (2006.01); C08K 3/36 (2006.01); C08K 5/03 (2006.01); C08K 13/02 (2006.01); C09K 21/08 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
B32B 3/266 (2013.01); B32B 15/08 (2013.01); B32B 27/08 (2013.01); B32B 27/20 (2013.01); C08J 5/18 (2013.01); C08K 3/36 (2013.01); C08K 5/03 (2013.01); C08K 13/02 (2013.01); C09K 21/08 (2013.01); H05K 1/0373 (2013.01); B32B 2264/10 (2013.01); B32B 2307/3065 (2013.01); B32B 2457/00 (2013.01); C08J 2345/00 (2013.01); C08J 2367/02 (2013.01); C08J 2425/06 (2013.01); H05K 2201/0209 (2013.01);
Abstract

A laminated uncured sheet of the present disclosure has a structure in which resin sheet layers and resin layers are alternately laminated and a through hole penetrating in the laminating direction is formed, wherein the resin sheet layers are formed with a thermosetting resin composition containing a thermosetting resin as a main component, the resin layers are formed with a thermoplastic resin composition containing a thermoplastic resin, and the thermoplastic resin composition is adhered to the inner wall surface of the resin sheet layer part in the through hole.


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