The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 30, 2022
Filed:
Jan. 19, 2017
Lg Electronics Inc., Seoul, KR;
Joonsang Yang, Seoul, KR;
Kyungdo Kim, Seoul, KR;
Seokjae Jeong, Seoul, KR;
Youngkyu Kim, Seoul, KR;
LG Electronics Inc., Seoul, KR;
Abstract
Disclosed is a mold assembly comprising: a cavity forming an inner space to be filled with resin containing metallic particles, and having a protruding part corresponding to a hole of a molded object; a first gate disposed at any one side of the cavity so as to inject the resin into the inner space; and a second gate disposed at another side of the cavity, and injecting the resin, which flows in a second direction intersecting with a first direction, into the inner space so as to change the arrangement of the metallic particles such that a weld line, formed according to the orientation of metallic particle in the first direction, is blurred in an area at which the flow of the resin is separated by the protruding part and then comes back together.