The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 30, 2022

Filed:

Aug. 24, 2020
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Zhiwei Wu, Shanghai, CN;

Yanmin Li, Shanghai, CN;

David Henry Abbott, Mason, OH (US);

Xiaobin Chen, Shanghai, CN;

Thomas Froats Broderick, Springboro, OH (US);

Judson Sloan Marte, Troy, NY (US);

Andrew Philip Woodfield, Maineville, OH (US);

Eric Allen Ott, Cincinnati, OH (US);

Assignee:

GENERAL ELECTRIC COMPANY, Schenectady, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 5/00 (2006.01); B22F 3/105 (2006.01); B22F 3/12 (2006.01); B22F 3/15 (2006.01); B22F 3/02 (2006.01); B22F 3/04 (2006.01); B22F 3/26 (2006.01); B22F 7/04 (2006.01); B23K 15/00 (2006.01); B22F 10/20 (2021.01); B22F 10/00 (2021.01); B23K 26/34 (2014.01); B33Y 10/00 (2015.01);
U.S. Cl.
CPC ...
B22F 5/00 (2013.01); B22F 3/02 (2013.01); B22F 3/04 (2013.01); B22F 3/12 (2013.01); B22F 3/1208 (2013.01); B22F 3/15 (2013.01); B22F 3/26 (2013.01); B22F 7/04 (2013.01); B22F 10/00 (2021.01); B22F 10/20 (2021.01); B23K 15/0086 (2013.01); B23K 26/34 (2013.01); B22F 2998/10 (2013.01); B33Y 10/00 (2014.12); Y02P 10/25 (2015.11);
Abstract

A method of manufacturing a three-dimensional target object may include forming a shell from loose machining powder using an additive manufacturing process and subjecting the shell to a densification process to form a target object. The shell may define an enclosure that contains additional machining powder. The densification process may include causing metallurgical bonding between the shell and additional machining powder contained in the enclosure defined by the shell and shrinking and/or distorting the shape of the shell to conform the target object to a three-dimensional model for the target object. The shell may include a plurality of layers and/or parts that differ at least in respect of density. The plurality of layers and/or parts may be configured based at least in part on the shrinking and/or distorting to the shape of the shell needed to conform the target object to the three-dimensional model for the target object.


Find Patent Forward Citations

Loading…