The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 30, 2022

Filed:

Jul. 20, 2018
Applicant:

Novelis Inc., Atlanta, GA (US);

Inventors:

Mehdi Shafiei, Farmington Hills, MI (US);

Andrew James Hobbis, Bath, CA;

David Anthony Gaensbauer, Atlanta, GA (US);

Jeffery Edward Geho, Marietta, GA (US);

Steven L. Mick, Fairmont, WV (US);

Assignee:

Noveliss Inc., Atlanta, GA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B21B 1/22 (2006.01); B21B 37/30 (2006.01); B21B 37/28 (2006.01); B21B 31/20 (2006.01); B21B 38/00 (2006.01); B21B 37/58 (2006.01); B21B 13/14 (2006.01); B21B 3/00 (2006.01); B21B 29/00 (2006.01); B21H 8/00 (2006.01);
U.S. Cl.
CPC ...
B21B 1/227 (2013.01); B21B 31/20 (2013.01); B21B 37/28 (2013.01); B21B 37/30 (2013.01); B21B 13/14 (2013.01); B21B 13/147 (2013.01); B21B 29/00 (2013.01); B21B 37/58 (2013.01); B21B 38/00 (2013.01); B21B 2001/228 (2013.01); B21B 2003/001 (2013.01); B21B 2261/14 (2013.01); B21B 2265/12 (2013.01); B21B 2267/10 (2013.01); B21H 8/005 (2013.01);
Abstract

Systems and methods of applying a texture on a substrate include applying a texture to the substrate with a work stand of a coil-to-coil process. The work stand includes an upper work roll and a lower work roll vertically aligned with the upper work roll. At least one of the upper work roll and the lower work roll includes the texture. Applying the texture includes applying, by the upper work roll and a lower work roll, a work roll pressure on an upper surface and a lower surface of the substrate. The method further includes adjusting a contact pressure parameter of the work stand such that the work stand provides a desired contact pressure distribution across the width of the substrate and a desired thickness profile of the edges of the substrate while an overall thickness of the substrate remains substantially constant.


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