The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 30, 2022

Filed:

Oct. 03, 2017
Applicant:

Koninklijke Philips N.v., Eindhoven, NL;

Inventors:

Wojtek Sudol, Andover, MA (US);

William John Ossmann, Acton, MA (US);

Stephen Davies, El Dorado Hills, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61B 8/12 (2006.01); A61B 8/08 (2006.01); A61B 8/00 (2006.01); B06B 1/02 (2006.01); B06B 1/06 (2006.01); H01L 23/00 (2006.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
A61B 8/12 (2013.01); A61B 8/0883 (2013.01); A61B 8/0891 (2013.01); A61B 8/4444 (2013.01); A61B 8/4483 (2013.01); A61B 8/4494 (2013.01); B06B 1/0215 (2013.01); B06B 1/0292 (2013.01); B06B 1/067 (2013.01); B06B 1/0622 (2013.01); H01L 24/48 (2013.01); H01L 25/162 (2013.01); B06B 2201/76 (2013.01); H01L 2224/48157 (2013.01);
Abstract

An imaging catheter assembly is provided. The imaging catheter assembly includes an interposer including a multi-layered substrate structure, wherein the multi-layered substrate structure includes a first plurality of conductive contact pads coupled to a second plurality of conductive contact pads via a plurality of conductive lines; an imaging component coupled to the interposer via the first plurality of conductive contact pads; and an electrical cable coupled to the interposer via the second plurality of conductive contact pads and in communication with the imaging component.


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