The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 23, 2022

Filed:

Jan. 16, 2020
Applicant:

Denso Corporation, Kariya, JP;

Inventors:

Kwan Ryul Kim, Kariya, JP;

Shotaro Yamasaki, Kariya, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H02M 3/335 (2006.01); H01F 27/28 (2006.01); H01L 25/16 (2006.01); H01L 27/02 (2006.01); H01L 23/367 (2006.01); H01F 27/02 (2006.01);
U.S. Cl.
CPC ...
H05K 7/209 (2013.01); H01F 27/025 (2013.01); H01F 27/28 (2013.01); H01L 23/3675 (2013.01); H01L 25/165 (2013.01); H02M 3/33576 (2013.01); H05K 7/20418 (2013.01);
Abstract

A DC-DC converter as an electric power source device has a magnetic component, a semiconductor component, a circuit substrate and a thermal conductive component. The magnetic component has a thermal energy discharge surface. The semiconductor component is electrically connected to the magnetic component. A controller arranged on the circuit substrate is electrically connected to the semiconductor component to control behavior of the semiconductor component. The thermal conductive component is arranged in a thickness direction of the circuit substrate to be overlapped with the magnetic component. The thermal conductive component is arranged, without being electrically connected with the semiconductor component and the circuit substrate, to face the thermal energy discharge surface of the magnetic component to allow thermal energy generated in the magnetic component to be conducted with the thermal conductive component.


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