The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 23, 2022

Filed:

Feb. 19, 2021
Applicant:

Synaptics Incorporated, San Jose, CA (US);

Inventors:

Toshifumi Ogata, Tokyo, JP;

Atsushi Maruyama, Tokyo, JP;

Goro Sakamaki, Tokyo, JP;

Assignee:

Synaptics Incorporated, San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); G06F 1/18 (2006.01); H05K 3/30 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); G06F 1/183 (2013.01); H05K 3/303 (2013.01); H05K 2201/10128 (2013.01); H05K 2201/10212 (2013.01); H05K 2203/166 (2013.01);
Abstract

A display panel includes a plastic substrate and a first inner lead bonding (ILB) electrode on the plastic substrate. The first ILB electrode includes a first bonding segment, a second bonding segment, and a first connection segment. The first bonding segment is extended in a first direction oblique to a vertical direction of the display panel. The first connection segment is configured to provide an electrical connection between the first bonding segment and the second bonding segment. The first bonding segment is configured to be bonded to a first display driver integrated circuit (DDIC) chip, and the second bonding segment is configured to be bonded to a second DDIC chip configured differently from the first DDIC chip.


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