The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 23, 2022

Filed:

Jan. 26, 2021
Applicant:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Inventors:

Yukio Nakabayashi, Yokohama, JP;

Tatsuo Shimizu, Shinagawa, JP;

Toshihide Ito, Shibuya, JP;

Chiharu Ota, Kawasaki, JP;

Johji Nishio, Machida, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/10 (2006.01); H01L 29/16 (2006.01); H01L 29/45 (2006.01); H01L 29/78 (2006.01); H01L 29/04 (2006.01);
U.S. Cl.
CPC ...
H01L 29/1608 (2013.01); H01L 29/045 (2013.01); H01L 29/7813 (2013.01);
Abstract

According to one embodiment, a semiconductor device includes a silicon carbide member, first, second, and third electrodes, and a first insulating member. The silicon carbide member includes first, second, and third silicon carbide regions. The first silicon carbide region includes first, second, third, and fourth partial regions. The third partial region is between the first and second partial regions. The fourth partial region is between the third partial region and the first electrode. The second silicon carbide region includes first and second semiconductor regions. The third silicon carbide region includes third and fourth semiconductor regions. The first insulating member includes first, second, and third insulating regions. The second electrode is electrically connected to the first silicon carbide region. The third and fourth partial regions are between the second and first electrodes. The third electrode is electrically connected to the second silicon carbide region.


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