The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 23, 2022
Filed:
Jul. 06, 2020
Applicant:
Boe Technology Group Co., Ltd., Beijing, CN;
Inventors:
Yingwei Liu, Beijing, CN;
Ke Wang, Beijing, CN;
Zhiwei Liang, Beijing, CN;
Muxin Di, Beijing, CN;
Zhanfeng Cao, Beijing, CN;
Shuang Liang, Beijing, CN;
Guangcai Yuan, Beijing, CN;
Qi Yao, Beijing, CN;
Dongni Liu, Beijing, CN;
Assignee:
BOE Technology Group Co., Ltd., Beijing, CN;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 25/18 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); H01L 23/5387 (2013.01); H01L 24/32 (2013.01); H01L 25/50 (2013.01); H01L 25/167 (2013.01); H01L 2224/3223 (2013.01); H01L 2224/32111 (2013.01);
Abstract
Provided are a display structure and a preparation method thereof, and a display apparatus. The display structure includes a flexible back plate and a display substrate which are stacked, the flexible back plate including a bonding electrode for bonding to an integrated circuit chip, and the flexible back plate being bent to form a bent portion on which the bonding electrode is located.